Principal Process Engineer, Die Bonding
Employment type
Full-time
Work setting
On-site
Location
Boise, ID
Schedule
Day shift
Posted
You'll be redirected to the employer's application page.
Job overview
The Principal Process Engineer, Die Bonding is an onsite role based in Boise, ID. Compensation is not specified for this position. This role is part of the Advanced Packaging Technology Development department. The role exists to start up, develop, and optimize die bonding processes. It contributes to the team by improving product quality, reducing costs, and resolving manufacturing line problems through failure analysis and process optimization.
What you'll do
- Develop and resolve die bonding process technologies
- execute process and equipment optimization initiatives
- lead yield improvement activities
- validate new process baselines
- manage material supplier relationships.
What we're looking for
- Education
- BS degree in Engineering, Physics, or related field
- Experience
- 8+ years in Semiconductor Process Engineering
- Skills & competencies
- full-timeday shiftboise idmicronprocess engineerdie bondingadvanced packagingsemiconductorengineeringyieldno weekendsno on-call
About the employer
Micron Technology, Inc. is hiring for this role. Industry: Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology). Sector: 54.
Additional details
- Industry sector
- 54
- Industry
- Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
- Occupation code
- 17-2112.00
You'll be redirected to the employer's application page.
Listing ID: 05dd002a-7188-47d6-afb9-dfdcd3dc336e