Mechanical/Thermal Principal Design Engineer

Job overview

The Mechanical/Thermal Principal Design Engineer is an onsite role based in Boise, ID. Compensation is not specified for this position, which supports the development of next-generation memory and AI computing platforms. This role exists to provide technical leadership and drive the mechanical and thermal architecture of hardware platforms. The engineer will influence product strategy and collaborate across global multidisciplinary teams to enable world-class computing solutions.

What you'll do

• Design, develop, and validate mechanical and thermal solutions for electronic systems.
• Develop innovative cooling solutions including heatsinks and liquid cooling.
• Define reliability and manufacturability requirements.
• Perform thermal CFD and mechanical FEA analyses.
• Lead design reviews and root cause investigations.

What we're looking for

Skills & competencies

full-time

day shift

boise id

micron

mechanical engineering

thermal engineering

hardware design

ai

semiconductor

onsite

Work arrangement

• Weekend coverage required

Benefits & perks

• Medical, dental, and vision plans
• income protection
• paid family leave
• paid time-off
• paid holidays.

Why this role

Requires 7+ years of experience in the electronics or semiconductor industry and expertise in thermal modeling.

About the employer

Micron Technology, Inc. is hiring for this role. Industry: Engineering Services. Sector: 54.